{"type":"rich","image_url":"https://cdn-ak.f.st-hatena.com/images/fotolife/V/Vengineer/20240506/20240506100934.png","width":"100%","blog_title":"Vengineer\u306e\u5984\u60f3","version":"1.0","html":"<iframe src=\"https://hatenablog-parts.com/embed?url=https%3A%2F%2Fvengineer.hatenablog.com%2Fentry%2F2024%2F05%2F07%2F080000\" title=\"TSMC\u306eCoWoS : 2024\u5e74\u304b\u3089\u306f\u3001CoWoS-S\u3058\u3083\u306a\u304f\u3066\u3001CoWoS-L\u306a\u306e\uff1f - Vengineer\u306e\u5984\u60f3\" class=\"embed-card embed-blogcard\" scrolling=\"no\" frameborder=\"0\" style=\"display: block; width: 100%; height: 190px; max-width: 500px; margin: 10px 0px;\"></iframe>","author_url":"https://blog.hatena.ne.jp/Vengineer/","provider_name":"Hatena Blog","author_name":"Vengineer","blog_url":"https://vengineer.hatenablog.com/","title":"TSMC\u306eCoWoS : 2024\u5e74\u304b\u3089\u306f\u3001CoWoS-S\u3058\u3083\u306a\u304f\u3066\u3001CoWoS-L\u306a\u306e\uff1f","height":"190","description":"\u306f\u3058\u3081\u306b \u4eca\u9031\u306e\u534a\u5c0e\u4f53\u30c1\u30c3\u30d7\u96d1\u8ac7\u306f\u3001\u30a4\u30f3\u30bf\u30fc\u30dd\u30fc\u30b6\u306e\u304a\u8a71\u3002\u305d\u306e\u4e2d\u3067\u3001TSMC\u306eCoWoS\u306e\u4ef6\u3002\u73fe\u5728\u306f\u3001CoWoS-S \u3067\u3001\u3053\u308c\u304b\u3089\u306f CoWoS-L \u304c\u51fa\u3066\u304f\u308b\u3068 TSMC\u306e2023\u306eAnnual Report\u3092\u898b\u3066\u78ba\u8a8d\u3057\u3066\u307f\u305f\u3044\u3068\u601d\u3044\u307e\u3059\u3002 TSMC 2023\u5e74 Annual Report CoWoS-S \u3068 CoWoS-L 51\u9801\u306e5.2 Technology Leadership\u306eCoWoS \u306e\u3068\u3053\u308d\u306b\u3001\u4e0b\u8a18\u306e\u3088\u3046\u306b\u3042\u308a\u307e\u3057\u305f CoWoS\u00ae advanced packaging service is the leading 2.5D technology to make ultra-hi\u2026","published":"2024-05-07 08:00:00","url":"https://vengineer.hatenablog.com/entry/2024/05/07/080000","categories":[],"provider_url":"https://hatena.blog"}